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            TF-008

            信息圖片 

            外形尺寸:11.25mm*11.35mm*1.32mm
            參數配置 :Micro-SD卡座:push-push

            1.MATERIAL
              Insulator:High Temperature Thermoplastic,
              UL94V-O
              Contact:Copper Alloy
              Shell:Copper Alloy
            2.PLATING
              Contact Area:Gold PLATED Over Ni.
              Solder Tail:Sn PLATED Over Ni.
              Shell Solder Arda:Gold PLATED Over Ni.
            3.ELECTRICAL
              Operating Temperature:-25℃ TO+90℃
              Current Rating:0.5mA max.
              Contact Resistance:100mΩ max.
              Insulation Resistance:1000MΩ min./500VDC

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